Product Description
Tungsten Disilicide is an electrically conductive inorganic, ceramic material. It is used in oxidation-resistant coatings, for hight temperature radiative cooking, and in heat shields.
Product Cost
Quantities May be Limited
The pricing for this product is subject to fluctuation based on market rates, therefore real-time pricing is not available. We recommend requesting a quote to receive accurate pricing information, via the quote tool on this page. Our pricing is influenced by multiple factors, and we strive to provide the most precise and up-to-date pricing details to our valued customers.
| Quantity (KG) | Price |
|---|---|
| 1-2 KG | Please Request a Quote |
| 3-10 KG | Please Request a Quote |
| 11-25 KG | Please Request a Quote |
| 26-100 KG | Please Request a Quote |
Note: Prices are subject to change without notice due to market conditions
Product Notes
100 gram mininum order
Standard packging: 500 gram, 1 kg, 5 kg containers
Can ship by UPS or FedEx
Atlantic Equipment Engineers, Inc. does not source any raw materials from the Democractic Republic of Congo, or the surrounding region that could be considered Conflict Minerals as outlined in the Dodd-Frank Wall Street Reform and Consumer Protection Act. (title XV, section 1502).
Standard packging: 500 gram, 1 kg, 5 kg containers
Can ship by UPS or FedEx
Atlantic Equipment Engineers, Inc. does not source any raw materials from the Democractic Republic of Congo, or the surrounding region that could be considered Conflict Minerals as outlined in the Dodd-Frank Wall Street Reform and Consumer Protection Act. (title XV, section 1502).
Product Document Sheets
Specifications
| Formula | WSi2 240.02 |
|---|---|
| Purity | 99.5% min |
| Particle Size | -325 Mesh |
| ECCN | - |
| Schedule B | 8101.10.0000 |
| CAS | CAS-12039-88-2 |
| Melting Point | 2165°C / 3929°F |
| Boiling Point | - |
| Density | 9.3 g/cm3 |
| Coef. of Expansion @ 20°C | - |
| Crystal Structure | Tetragonal |
| Electric Resistivity | 60–80 µO?c |
| Composition | W- 76.60, Si- 23.4 |
Form
Powder
Applications
Electronics, Ceramics, Thin / Thick Film, Microelectronics